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Joined:
10-26-2022 |
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Last Visit:
10-26-2022, 08:53 AM |
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Online For:
2 Minutes, 58 Seconds |
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[Details]
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| User Bio | |
| Location: Huizhou City, Guangdong，China |
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| Bio: Electronic products of aerospace and navigation, motor vehicles, automobiles, outdoor LED lighting, solar energy and military enterprises with high reliability requirements, solder ball array devices (BGA/CSP/WLP/POP) and special devices on circuit boards are all facing microelectronics. The trend of miniaturization, and thin PCBs with a thickness of less than 1.0mm or flexible high-density assembly substrates, solder joints between devices and substrates become fragile under mechanical and thermal stress. |
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| Sex: Undisclosed |
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